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| No.1793269
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Information Name: | Encapsulation material supply resistance |
Published: | 2012-03-15 |
Validity: | 30 |
Specifications: | |
Quantity: | 0.00 |
Price Description: | Negotiable |
Detailed Product Description: | Our new products Wirewound resistors and ceramic bonding material, lead, made according to customer needs brown, black and other colors. With a coefficient of thermal expansion material with ceramic matrix matching is good, good mobility, excellent electrical properties, good sealing resistor smooth surface, air tightness, no aging characteristics of the wire wound resistors and the preferred adhesive tiles material. Project Performance Sealing temperature (℃) ≤ 600 Volume Resistivity (MΩ · cm) Room temperature (1.95 ~ 3.95) × 108 300 ℃ (1.01 ~ 3.69) × 106 Breakdown Strength (kv / mm) ≥ 23.08 Flexural strength (MPa) (117.65 ~ 146.57) K 5.85 ~ 7.65 Dielectric loss (86 ~ 109) × 10-4 Thermal expansion coefficient (℃ -1) 70.5 × 10-7 Material Type Unleaded Use Wirewound resistors sealed with outsourcing, porcelain bonding Project Performance Sealing temperature (℃) ≤ 600 Volume Resistivity (MΩ · cm) Room temperature (1.95 ~ 3.95) × 108 300 ℃ (1.01 ~ 3.69) × 106 Breakdown Strength (kv / mm) ≥ 23.08 Flexural strength (MPa) (117.65 ~ 146.57) K 5.85 ~ 7.65 Dielectric loss (86 ~ 109) × 10-4 Thermal expansion coefficient (℃ -1) 70.5 × 10-7 Material Type Unleaded Use Wirewound resistors sealed with outsourcing, porcelain bonding Project Performance Sealing temperature (℃) ≤ 600 Volume Resistivity (MΩ · cm) at room temperature (1.95 ~ 3.95) × 108 300 ℃ (1.01 ~ 3.69) × 106 Breakdown Strength (kv / mm) ≥ 23.08 Flexural strength (MPa) (117.65 ~ 146.57) Dielectric constant of 5.85 ~ 7.65 Dielectric loss (86 ~ 109) × 10-4 Thermal expansion coefficient (℃ -1) 70.5 × 10-7 Type of material does not lead Use wirewound resistors sealed with outsourcing, porcelain bonding |
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Copyright © GuangDong ICP No. 10089450, Powder technology companies Anhui Xinlei All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
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You are the 111045 visitor
Copyright © GuangDong ICP No. 10089450, Powder technology companies Anhui Xinlei All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
AllSources Network's Disclaimer: The legitimacy of the enterprise information does not undertake any guarantee responsibility