I produced the glass encapsulation medium paste, material system is divided into two kinds of leaded and unleaded. Sintering temperature is divided into two kinds of low and high temperature. Mainly used in glass glaze resistor (such as rod-like resistance and high glass glaze resistors, etc.), thick film circuit, chip resistors and other electronic components made of outsourcing slurry seal. Film sintered bright little effect on resistance; has excellent acid resistance and adhesion. Mainly used for thick-film hybrid integrated circuits and resistor networks.