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- home > Supply > Heat sink, cooling the substrate with a filler (MC substrate), thermal grease, phase change film alumina packing ball
Heat sink, cooling the substrate with a filler (MC substrate), thermal grease, phase change film alumina packing ball
Information Name: | Heat sink, cooling the substrate with a filler (MC substrate), thermal grease, phase change film alumina packing ball |
Published: | 2012-03-15 |
Validity: | 30 |
Specifications: | |
Quantity: | 0.00 |
Price Description: | Negotiable |
Detailed Product Description: | Α alumina ball alumina products, used as rubber, plastic filler and ceramic materials, their superior performance shows. Features 1, the high filling The high rate of spherical particles, they can be of rubber, plastic, high density padding, get low viscosity, good fluidity of the mixture. 2, thermal conductivity Because of its high density can be filled, compared with the crystalline silicon can be obtained high thermal conductivity, heat dissipation and good mixture. 3, low wear Because of their spherical appearance of mixing machines, molding machines and molds and other equipment greatly reduce wear, extend equipment life. Use (1) heat sink, cooling the substrate with a filler (MC substrate), thermal grease, phase change film (2) semiconductor packaging resin filler (3) silicone adhesive and heat the mixture with the filler (4) ceramic filter |
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Copyright © GuangDong ICP No. 10089450, Powder technology companies Anhui Xinlei All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
AllSources Network's Disclaimer: The legitimacy of the enterprise information does not undertake any guarantee responsibility
You are the 111045 visitor
Copyright © GuangDong ICP No. 10089450, Powder technology companies Anhui Xinlei All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
AllSources Network's Disclaimer: The legitimacy of the enterprise information does not undertake any guarantee responsibility