Anhui Xinlei Powder Technologies is a research and development, production and management, technical advice, materials testing in one of the high-tech enterprise, is committed to non-metallic mineral products, research and development and has advanced powder production process, is the use of proprietary technology-and pollution-free production of natural melting crystalline ultrafine (1um) ultrapure SiO299.99) quartz powder companies, the production of epoxy molding compound, low-E electronic packaging of the spherical silica powder and quartz powder with LED package. Control the precise size, exports, and domestic famous enterprises of all industries, is the IT industry's core technology products (computer chips, fiber optics, electronics industry, new electric light, high insulation sealing, aerospace equipment, military technology products, etc.) of high quality raw materials. Specifications subject to international standards. The company has independent intellectual property rights of the patented technology, our products lead at home, use our quartz powder can reduce production costs. 

 Our spherical silica powder and quartz powder used for electronic packaging materials for electronics assembly: ① for LED, SMD, EMC to electronic components, electrical products, epoxy encapsulation materials, the main role is waterproof, anti-dust, anti-harmful gases and slow down vibration, and stability of the circuit to prevent external damage. Ultra-fine high purity electronic grade quartz powder is large scale integrated circuit substrates and electronic packaging materials, raw materials, which together with epoxy resin to complete the cementing bond chips or components, ultra-fine silica powder in the epoxy resin determines the mixing ratio in the substrate thermal expansion coefficient, the higher the proportion of quartz powder, the smaller the coefficient of thermal expansion substrate can avoid uneven expansion result in the destruction of silicon micron lines, therefore, the purity of the quartz powder, fine degree and size distribution, there are strict requirements. Electronic packaging materials account for 80% of the epoxy molding compound, silicone packaging materials account for 20%. Electronic materials in the filled epoxy molding heightened purity ultra-fine and nano silica content of 70 ~ 90% with excellent workability, shrinkage is small, thermal expansion coefficient, acid and solvent good insulation, good mechanical properties , and epoxy resin mixture of transparency, and electronic packaging materials account for 80% of the epoxy molding compound, silicone packaging materials account for 20%. Electronic materials in the filled epoxy molding heightened purity ultra-fine and nano silica content of 70 ~ 90% with excellent workability, shrinkage is small, thermal expansion coefficient, acid and solvent good insulation, good mechanical properties and other characteristics. IT industry is the core technology products (computer chips, fiber optics, electronics industry, new electric light, high insulation sealing, aerospace equipment, military technology products, etc.) of high quality raw materials. ② electronic substrate materials (electronic ceramics) to add ultra-pure ultra-fine silica powder can be reduced after the sintering temperature, and can play a two-phase and recovery phase toughening, dense, increase the strength of the effect. Plastic packaging products, electronic industry, the basic raw materials.