Anhui Xinlei Powder Technologies is high-tech enterprise, is committed to non-metallic mineral products, research and development and has advanced powder production process, is the use of proprietary technology cleaner production company of natural high purity spherical silica, exclusive domestic production of spherical silica and low radiation electronic packaging LED, SMD, EMC Packaging silica fume. Product advantage is high whiteness and high purity. Features ultra-fine, the minimum size 1um, accurate size control, exports, and domestic famous enterprises of all industries, the company has been manufacturing special function continuous R & D products, the company's patented technology with independent intellectual property, Our products are leading in China. 

 Our electronic-grade silicon powder used in electronic assembly materials: ① for LED, SMD, EMC to electronic components, electrical products, electronic packaging materials, the main role is waterproof, anti-dust, anti-harmful gas, slowing the vibration, to prevent external damage and stable circuit. Ultra-fine high purity electronic grade silicon powder is the large scale integrated circuit substrates and electronic packaging materials, raw materials, which together with epoxy resin to complete the cementing bond chips or components, ultra-fine silicon powder in epoxy resin determines the mixing ratio in the substrate thermal expansion coefficient, the higher the proportion of silica fume, the smaller the coefficient of thermal expansion substrate can avoid uneven expansion result in the destruction of silicon micron lines, therefore, the purity of silicon powder, fine degree and size distribution, there are strict requirements. Electronic packaging materials account for 80% of the epoxy molding compound, silicone packaging materials account for 20%. Electronic materials in the filled epoxy molding heightened purity ultra-fine and nano silica content of 70 ~ 90% with excellent workability, shrinkage is small, thermal expansion coefficient, acid and solvent good insulation, good mechanical properties , and epoxy resin mixture of transparency, and electronic packaging materials account for 80% of the epoxy molding compound, silicone packaging materials account for 20%. ② electronic substrate materials (electronic ceramics) to add ultra-pure ultra-fine silica fume can be reduced after the sintering temperature, and can play a two-phase and multiphase toughening, dense, increase the strength of the effect. Plastic packaging products, electronic industry, the basic raw materials. 

 The company's core philosophy is to use my company's proprietary technology to create value for our customers to meet customer needs, outstanding customer service in the sense of proceeding from reality, such as the need for our products, please provide the product uses, chemical composition, grain degree distribution or samples.