Anhui Xinlei Powder Technologies is a research and development, production and management, technical advice, materials testing in one of the high-tech enterprise, exclusive domestic production of low-E high-quality electronic packaging spherical quartz powder and LED, SMD, EMC Packaging quartz powder , use our quartz powder can reduce production costs. 

 Spherical silica powder filled epoxy molding compound of the thermal conductivity, expansion coefficient, as a microelectronic device substrate and package up to 90% fill rate can be used as large-scale, ultra-large scale integrated circuit ideal substrate material and packaging material. 





 At present, electronic packaging materials (resin and silica powder) more than 50% have to rely on imports. All high purity spherical silica powder imported from abroad. With the increased performance requirements of microelectronic components, filling silica particles to spherical particles by the angular speed of the transition is being accelerated, ultra large scale integrated circuits have been used in all spherical silica, spherical particles of silica powder particles has been replaced by the microelectronics industry angular material development trend. 

 Spherical fused silica powder as a new type of inorganic materials used in electronic materials, not only sealing material epoxy molding, also widely used in building materials, medical care, transport, metallurgy, petroleum, machinery, fine chemical industry.