The core of electronic equipment and devices are the various semiconductor chips. Can be said that the semiconductor industry is the heart and soul of the electronics industry. In the manufacture of semiconductor chips and devices such process, semiconductor chips have a very high accuracy requirements, called for compound semiconductor wafer or substrate surface precision grinding. Our precision grinding of spherical silica powder is the most suitable substrate for these semiconductor materials for precision grinding. 

 Use of spherical silica fume is more special for the production of a precision grinding powder. It is made of high quality raw materials, using our proprietary technology, in accordance with strict production procedures and quality control system from production. Has a stable grinding performance, not caused by the grinding of the chip surface scratches. Its quality and stability, high surface cleanliness, no large particles, grinding performance, is a very good grinding abrasive materials. 

 Spherical silica fume is not only suitable for silicon, compound semiconductor surface grinding, polishing, but also suitable for hard glass, crystal, optical lenses, prisms and other glass products such as optical grinding, polishing. Particularly suitable for grinding and polishing of semiconductor single crystal silicon films, Picture Tubes glass screen, optical glass, liquid crystal display (LCD, LED) glass substrate, piezoelectric quartz crystal, compound semiconductor materials (gallium arsenide, indium phosphide), magnetic materials and other semiconductor industry. Using high purity spherical silica sol due to ultra-high pure slurry, is mainly used for precision silicon wafer polishing, CMP Slurry modulation integrated circuit, widely used in various sizes of Si films, Ge films, GaAs films, The ILD and conductor integrated circuits, quartz glass, hard substrate, IC circuit, optoelectronic crystal materials, LED materials, the sapphire substrate surface precision film chemical mechanical polishing (CMP) processing of. In particular, the final step of polishing. 

 Anhui Xinlei powder company with independent intellectual property patents technology, products and stable supply to Japan, the United States, Europe, Korea and domestic customers, domestic users has been gradually replace imported products with my company. Grinding and polishing materials I lead at home.