Anhui Xinlei powder technology company is mainly engaged in the development of silicon materials research, production management, technical consulting, materials testing in one of the high-tech enterprises, to spherical silica fume and LED packaging, and electronic materials research and development of advanced powder production process, pollution-free production of proprietary technology is the use of epoxy molding compound, low radiation with high-quality electronic packaging spherical silica (product rate of the ball, so ball rate, melting rate and high purity and other indicators of similar products meet or exceed international the level of technical indicators) and the LED, SMD, EMC Packaging of high purity quartz powder, product advantage is high whiteness, high purity (99.9 ~ 99.99%). Features ultra-fine, the smallest particle size 0.1um (available upon request producing ultrafine silica fume). Control the precise size, exports and import substitution products, the IT industry's core technology products (computer chips, fiber optics, electronics industry, new electric light, high insulation sealing, aerospace equipment, military technology, products, etc.) high-quality raw materials. Specifications subject to international standards. Our company is producing two series, a dozen standard spherical silica, which is mainly used for electronic materials products. The company has independent intellectual property rights of the patented technology, our products are leading in China, the use of silica fume can reduce our production costs. Meet customer needs is our responsibility, the customer may make any special requirements technical requirements, we can on behalf of research and development. 

 Spherical silica is large scale integrated circuit substrates and electronic packaging materials, raw materials, which together with epoxy resin to complete the cementing bond chips or components, spherical silica in epoxy resin mixed with the proportion of decisions the substrate thermal expansion coefficient, the higher the proportion of spherical silica fume, the smaller thermal expansion coefficient of the substrate, to avoid uneven expansion result in the destruction of silicon micron lines, therefore, the purity of silicon powder, fineness and size distribution There are strict requirements. Electronic packaging materials account for 80% of the epoxy molding compound, silicone packaging materials account for 20%. Electronic materials in the filled epoxy molding heightened purity ultra-fine and nano spherical silica content of 70 ~ 90% with excellent workability, shrinkage is small, thermal expansion coefficient, acid and solvent insulation, good mechanical properties good features, and epoxy resin mixed transparency, and electronic packaging materials account for 80% of the epoxy molding compound, silicone packaging materials account for 20%. ③ electronic substrate materials (electronic ceramics) to add ultra-pure ultra-fine spherical silica fume can be reduced after the sintering temperature, and can play a two-phase and recovery phase toughening, dense, increase the strength of the effect. The electronics industry, the basic raw materials, packaging products.