At present, China has a lot of CCL Factory G-I0 and FR-4 epoxy laminate production is still a single or a single curing agent resin formulation, it can not meet the requirements of the growing PCB production. In the improved model FR-4 Copper Clad Laminate improve performance, add the spherical silica powder in a large-scale, very large scale integrated circuits and packaging laminate compound, has become an indispensable quality materials. Spherical silica powder, with a smooth surface, surface area, hardness, chemical stability, expansion coefficient, rolling resistance is good, excellent mechanical properties, and other unique properties. With the rapid development of microelectronic industry, large-scale, ultra-large scale integrated circuit packaging material requirements of the increasingly high demand not only for its fine, and requires that they have high purity and low content of radioactive elements, especially for particles spherical shape of the proposed requirements. Ultra high purity fused silica because of its high spherical dielectric, high heat, high humidity, high filler content, low expansion, low stress, low impurities, low friction coefficient, superior performance, is indispensable CCL quality raw materials. Spherical silicon powder as raw material with CCL, the product of the thermal shock resistance and have a lot of influx of the increase. 

 Spherical silica surface flow is good, even with the resin film mixing, add a small amount of resin, and the most liquid, powder can be filled in the highest weight ratio up to 90.5%, therefore, of the mean spherical silica filling ratio increases, the higher the fill rate of silica powder, the smaller the thermal expansion coefficient, the lower the thermal conductivity, the closer the thermal expansion coefficient of silicon, thus the production of electronic components the better the performance. Second, the ball made of plastic material of the minimum stress concentration, the highest intensity, when the angular powder molding compound stress concentration is 1, the stress is only 0.6 spherical powder, therefore, spherical powder molding compound packaging integrated circuit chip, the yield high, and the transportation, installation and use of the process is not easy to produce mechanical damage. Third, the spherical powder, friction, wear and tear on the mold is small, so that long life die, compared with the angular powder can increase up to twice the life of the mold, plastic mold packaging material prices are high, and some also need to import, which is on the packaging factory to reduce costs, improve economic efficiency is also important. 

 Anhui Xinlei powder technology company is mainly engaged in the development of silicon materials research, production management, technical consulting, materials testing in one of the high-tech enterprise, is committed to non-metallic mineral products, research and development and has advanced powder production technology, proprietary technology is the use of pollution-free production of natural melt-and Low-E high-quality electronic packaging spherical silica (product rate of the ball, so ball rate, melting rate and high purity and other indicators meet or exceed international similar products), exports and to replace imported products, specifications subject to international standards. My company is now producing more than a dozen standard spherical silica powder, the series is mainly used for material additives, the company has independent intellectual property rights of the patented technology, our products lead at home to meet customer needs is our responsibility, particularly if customers requirements may make technical requirements, we can on behalf of research and development.